Capable of diagnosing own state and reporting to the host device
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UL/C-UL , CE , FDA Approved
Products
Before the introduction of Self-Monitoring Sensors
- We want to avoid production line stoppage that might occur due to unexpected sensor failure.
Line stoppage hours × (manufacturing unit cost / hour) = Loss - We want to minimize the production line downtime to almost zero.
Problems
- The amount of data to be collected is large and this may lower the PLC processing capacity.
- The burden of data analysis is large.
- Resetting the replaced sensors is troublesome.
After the introduction of Self‑Monitoring Sensors From preventive maintenance to predictive maintenance
Leave the sensor diagnosis to the sensor itself.
| ● | All you need to do is to monitor the sensor state. |
|---|---|
| ● | PLC can be used exclusively for controlling devices. |
| ● | Possible to check detail information at a desired timing. |
Leave the resetting for replaced sensors to the higher-level master
| ● | Automatically written from the connected master. |
|---|---|
| ● | Possible not only to save time but also to prevent human errors. |
Before the introduction of Self-Monitoring Sensors
- We want to place sensors close to sensing points as much as possible.
However, it is often difficult to make settings, particularly when there are many sensors to install. - We want to send predetermined parameter values in a batch file for a repeater, etc.
- We want to confirm that required sensors are properly connected at the startup of the system.
Problems
- It takes time to set sensors.
- We want to avoid mistakes in setting sensors or wiring.
After the introduction of Self‑Monitoring Sensors
Fully utilize the advantages of the IO‑Link output.
- Possible to read or write set values through external
interface. - Possible to set multiple sensors in a batch process.
- Possible to save the set parameters in an external medium.
- Possible to recognize and discriminate individual information.
| Type | Measurement center 30 mm 1.181 in type |
Measurement center 50 mm 1.969 in type |
Measurement center 100 mm 3.937 in type |
Measurement center 200 mm 7.874 in type |
Measurement center 400 mm 15.748 in type |
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| Model No. | Discrete wire | HG-C1030L3-P | HG-C1050L3-P | HG-C1100L3-P | HG-C1200L3-P | HG-C1400L3-P |
| M12 connector | HG-C1030L3-P-J | HG-C1050L3-P-J | HG-C1100L3-P-J | HG-C1200L3-P-J | HG-C1400L3-P-J | |
| Regulatory compliance and certification |
EMC Directive, RoHS Directive, FDA Regulations, UL/c-UL Certification | |||||
| Measurement center distance | 30mm 1.181 in |
50mm 1.969 in |
100mm 3.937 in |
200mm 7.874 in |
400mm 15.748 in |
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| Measurement range | ±5mm 0.197 in |
±15mm 0.591 in |
±35mm 1.328 in |
±80mm 3.150 in |
±200mm 7.874 in |
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| Repeatability | 10μm 0.394 mil |
30μm 1.181 mil |
70μm 2.756 mil |
200μm 7.874 mil |
300μm 11.811 mil (Measuring distance 200～400mm 7.874 to 15.748 in) 800μm (Measuring distance 400～600mm 15.748 to 23.622 in) |
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| Linearity | ±0.1%F.S. | ±0.2%F.S. | ±0.2%F.S. (Measuring distance 200～400mm 7.874 to 15.748 in) ±0.3%F.S. (Measuring distance 400～600mm 15.748 to 23.622 in) |
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| Temperature characteristic | 0.03%F.S./℃ | |||||
| Light source | Red semiconductor laser Class 2 [IEC / JIS / GB / FDA (Note 2)] Max. output: 1 mW, emission peak wavelength: 655 nm 0.026 mil | |||||
| Beam diameter (Note 3) | ø50μm 1.969 milapprox |
ø70μm 2.756 milapprox |
ø120μm 4.724 milapprox |
ø300μm 11.811 milapprox |
ø500μm 19.685 milapprox |
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| Supply voltage | 24V DC±10% Ripple P-P10% | |||||
| Power consumption | 40 mA or less (at 24 V DC supply voltage) | |||||
| Communication output (C/Q) (Note 4) |
IO-Link communication | IO-Link Specification V1.1 | ||||
| Baud rate | COM3(230.4kbps) | |||||
| Process data | 4byte | |||||
| Minimum cycle time | 1.0ms | |||||
| Control output (DO) | PNP open-collector transistor •Maximum source current: 50 mA • Applied voltage: 30 V DC or less (Between control output to +V) • Residual voltage: 1.5 V or less (at 50 mA source current) • Leakage current: 0.1 mA or less |
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| Output operation | Switchable between either Light-ON or Dark-ON | |||||
| Short-circuit protection | Incorporated (auto reset type) | |||||
| Response time | Switchable between 1.5 ms / 5 ms / 10 ms | |||||
| Pollution degree | 2 | |||||
| Ambient altitude | 2,000 m 6561.680 ft or less | |||||
| Environmental resistance | Protection | IP67(IEC) | ||||
| Ambient temperature | -10～+45℃ -14 to 113℉(No dew condensation or icing allowed)、Storage：-20～+60℃ -4 to 140℉ | |||||
| Ambient humidity | 35 to 85 % RH, Storage: 35 to 85 % RH | |||||
| Ambient illuminance | Incandescent light: 3,000 ℓx or less at the light-receiving face | |||||
| Vibration resistance | 10 to 55 Hz (period: 1 min.) frequency, 1.5 mm 0.059 in double amplitude in X, Y and Z directions for two hours each | |||||
| Shock resistance | 500 m/s2 acceleration (50 G approx.) in X, Y and Z directions three times each | |||||
| Cable | Discrete wire type: 0.2 mm2 4-core PVC cable, 2 m 6.562 ft long M12 connector type: 0.2 mm2 4-core PVC cable with connector, 0.3 m 0.984 ft long |
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| Cable extension | Extension up to total 20 m 65.617 ft is possible with 0.3 mm2, or more, cable. | |||||
| Material | Enclosure: Aluminum die-cast, Front cover: Acrylic | |||||
| Weight | Discrete wire type: 30 g approx. (without cable), 80 g approx. (including cable) M12 connector type: 30 g approx. (without cable), 50 g approx. (including cable) |
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